ColorChip Ltd. (Israel) has introduced its 800Gbps 2xFR4, DR8 transceiver modules, as well as 800Gbps ACCs and AECs, and 1.6Tbps AEC cables, all designed to greatly increase data center and networking performance.
According to the company, "these solutions solve connectivity challenges from the first millimeter up to 10 km." ColorChip further contends in a press release that, "with data centers, carriers, and MSOs rapidly migrating to 800Gbps and 1.6Tbps capability, a cost-effective, low power, and reliable connectivity solution is an absolute requirement."
Within data center planning, reducing the total cost per gigabit is a key requirement that ColorChip says its products provide.
At OFC 2023 (March 7-9) in San Diego, ColorChip is demonstrating its full spectrum of 100G/Lane products, including 400G in QSFP112, 800G in QSFP-DD800, OSFP 800G ACC, AEC, SR8, DR8, 2xFR4 series, and 1.6T OSFP-XD AEC products.
ColorChip says that options to address data centers' power consumption and performance demands include its system-on-glass, silicon photonics, linear direct drive optics, and 5nm DSP-enabled low power technologies, showcased at OFC in various product lines, and jointly with the company's switch and key component supplier partners.
At OFC 2023, ColorChip also supplied its glass interposer and AR glass demonstrations for showcase and participated the OIF's interoperability demo.
Yigal Ezra, CEO of ColorChip Group, commented:
"ColorChip's technical innovations are driven by customers' feedback from engineering to operations groups. We always look for opportunities where we can reduce costs per Gigabit to help customers build a more robust network through our connectivity solutions. The 800Gbp and 1.6Tb technology is a great example where we are addressing the challenges that arise as data throughput increases rapidly."
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