Senko, US Conec Resolve VSFF Patent Disputes

Senko Advanced Components Inc. and US Conec Ltd. have settled their patent-infringement disputes regarding very small form factor (VSFF) fiber-optic connectors and adapters. In a statement announcing the resolution, the companies explained, “All pending lawsuits on this subject matter are dismissed, as are administrative challenges to the parties’ patents in the United States Patent and Trademark Office.”

As a result of this resolution, each company retains its current portfolio of patents covering VSFF products that were at issue in the legal cases. Also under the agreement’s terms, “both parties and their licensees, distributors, and customers may continue to offer their current VSFF products.” Additionally, as part of the legal settlement, Senko is now able to offer MMC connector and adapter products, and US Conec is able to offer SN connector and adapter products.

“The parties have also resolved patent disputes regarding MPO products so that both parties and their licensees, distributors, and customers may continue to provide their respective MPO products,” the statement added.

All other provisions of the legal agreement ending the patent disputes remain confidential.