Global connectivity and electronics solutions provider Molex announced that it has taken steps to scale global deployments of its high-speed copper and optical interconnects and modules to help customers better address demands for higher bandwidth. These steps include the following:
- Introduction of new 112G Active Electrical Cables join the company's exisiting family of copper solutions to extend reach.
- Availability of a full menu of options enable 'mix and match' capability based on distance and application.
- Molex is now teaming with Celestica and Innovium to deliver compelling reference designs.
Molex's broad range of next-generation connectivity solutions leverages the latest advancements in copper and optics to deliver high signal integrity, lower latency and reduced insertion loss for optimal efficiency, speed and density.
As cited by the company, Gartner expects end-user spending on global data center infrastructure to reach $200 billion this year, as large enterprise facilities resume expansion while hyperscalers continue to expand globally. Additionally, skyrocketing demand for bandwidth-intensive, data-driven services, which accelerated during COVID-19, is fueling a rise in compute, data storage and networking capabilities.
To keep pace, Molex notes that companies are moving from monolithic data center designs to distributed and disaggregated architectures, which creates significant connectivity challenges.
"There is no such thing as 'one size fits all' interconnect technologies to support different applications across today's enterprise and hyperscale data centers," observes Aldo Lopez, president, Datacom Solutions, Molex. "We offer our customers and ecosystem partners the broadest portfolio of future-proof interconnect solutions, which ease transitions to new architectures and simplify engineering development while reducing costs and time to market."
Driving copper innovations with new 112G AEC cables
Molex has added its new 112G Active Electrical Cables (AEC) to its line of copper interconnect solutions that extend link reach at higher data rates. The company says the new AEC offering increases reach up to five meters without requiring optical cables, while also supporting smaller conductors for improved cable management. AEC can also support gearbox capabilities, as well as smart cable functionality for adding an extra measure of system-level redundancy, adds the company.
This latest addition to the Molex copper interconnect family joins the company's Active Copper Cable (ACC) line, which it notes works just like passive cable to extend the reach of external cabling and supports low-power linear amplifier-based semiconductors for improved power management and thermal needs. Rounding out the copper lineup is Molex's BiPass technology, which is designed to deliver best-in-class signal integrity with multiple near-ASIC connector solutions, including TGA and the NearStack family of connectors.
Molex's vertical BiPass implementation offers superior thermal performance and low-power requirements, which let data centers reduce their carbon footprints. BiPass also provides low latency for end-to-end channel performance while lowering TCO by reducing printed circuit board (PCB) costs.
Meeting changing data center landscapes with 100G optical transceivers
Molex also is driving industry-wide efforts to increase adoption of 100G and 400G optical links and module technologies. The company announced it is ramping deployment of a complete range of 100G per lambda transceivers for high-performance data center, cloud and wireless connectivity.
As part of its customer-centric and partner-focused activities, Molex supports a full IEEE- and MSA-compliant portfolio and product roadmap to meet both intra-data center interconnect, and data center interconnect requirements. The company's expanding optical transceiver family includes 100G-DR, 100G-FR, 100G-LR, 400G-DR4 (500m and 2km), 400G-FR4, 400G-LR4, 400G-ZR and 400G-ZR+ as well as 800G roadmap products.
Molex's pluggable optical transceiver models all benefit from the company's vertical-integration expertise in silicon photonics, photonic integration, module assembly and packaging. Together, these integrated capabilities and experience enable Molex to deliver optimized data rates and low power consumption in a small form factor.
Amit Sanyal, VP of marketing at Innovium, commented, "Collaborating with Molex on next-generation interconnect innovations and reference designs enables us to meet evolving customer needs. Innovium's highly power efficient 32-port 800G TERALYNX 8 switch leverages Molex's pluggable QSFP-DD800 modules and BiPass I/O technology to drive better performance and operational efficiencies while benefiting customers with the delivery of pre-tested and pre-validated reference designs."
Randy Clark, sr. director, Product Solutions, at Celestica, added, "Celestica has developed a wide range of end-to-end infrastructure systems that support powerful datacenter solutions. In collaborating with Molex, we are propelling the industry forward with our development of the first reference switches to use Molex's vertical BiPass implementation, delivering the thermal and signal-integrity performance needed for 112G systems."
For more information, visit www.molex.com.
