At the AFCOM 2023 Data Center World Conference (May 8-11) in Austin, Texas, Chatsworth Products, Inc. (CPI) is exhibiting an integrated cabinet solution for direct-on-chip dielectric liquid cooling in data centers.
Among the products on display in CPI's booth at the show is the company's flagship data center cabinet platform, the ZetaFrame Cabinet System, specially outfitted with dielectric liquid cooling technology from ZutaCore, whose HyperCool platform uses a two-phase, waterless, direct-on-chip method of removing heat away from the processors.
As reckoned by the company, as workloads cause the processors to heat, the HyperCool platform's dielectric liquid absorbs the heat, causing the liquid to boil and vaporize. The state change from a liquid to a gas is a highly efficient mechanism to remove the heat, which is then expelled outside of the data center or used via heat re-use applications, enabling zero emissions.
CPI contends that such advancements will help usher in more sustainable, environmentally-friendly, and carbon-neutral technology infrastructure across the data center industry.
Value proposition
The company says its proof-of-concept hardware demonstration at Data Center World comes at a time when emerging technologies such as artificial intelligence and high-performance computing are driving increased need for more energy efficient methods of cooling and power consumption.
The hardware integration, made possible by the ZetaFrame's 4,000 lb. dynamic load rating for an interior payload, supports a fully integrated rack containing the ZutaCore components, and enables secure transport of a loaded rack and cooling system when used in conjunction with a shock pallet.
These components include the ZutaCore HyperCool manifold, which easily mounts to CPI's dual vertical power distribution unit (PDU) bracket using button mount features and a heavy-duty shelf support, with transportation tie-down brackets for the ZutaCore HyperCool heat rejection unit (HRU).
This unique setup also allows for easy integration of CPI's eConnect Power Distribution Units (PDUs), standard ZetaFrame cable management and airflow management accessories.
CPI's director of product management and hyperscale business development, Todd Schneider, commented:
"We're excited to share this new technology capability with Data Center World attendees. Not only does it demonstrate CPI's expertise for designing solutions that scale to support today's most modern liquid cooling technologies, but it also confirms the high degree of configurability and strength that makes ZetaFrame an ideal choice for integrators looking to ship and deploy complete solutions."
Rack and stack
Data Center World 2023 attendees are this week getting an eyeful Chatsworth's full array of data center infrastructure technologies including the company's: eConnect PDUs, offering intelligent power management, monitoring and control capabilities; uninterruptible power supply (UPS) battery backup systems to ensure IT uptime and reliability; CPI's Adjustable Cable Runway for creating a flexible pathway for network cabling; and the company's CUBE-iT Wall-Mount Cabinets, designed to protect sensitive electronic equipment in tight spaces.
CPI's presence at this year's Data Center World is further amplified as the company is a participating technology sponsor in the event's specially billed "Rack and Stack Competition." The special session, happening Tuesday, May 9 in the conference expo hall, will host a bracket-style championship to determine who is the best and fastest "racker and stacker" when it comes to dressing a fully-configured and functional data center stack.
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