Panduit's HD Flex Fiber Cabling System
TINLEY PARK, Ill. -- Panduit Corp., a major global provider of electrical and network infrastructure products and technology solutions, recently announced the opening of its 18,000 sq. ft. Jack E. Caveney Innovation Center in Tinley Park, IL -- a facility that now accommodates more than 70 members of Panduit’s Research and Development (R&D) team.
Named for one of the most prolific inventors in the electrical and nascent telecommunications-oriented industries -- and the founder of Panduit -- the company's R&D center "will carry on his legacy that began almost 60 years ago," stated a company news release. "Throughout this period Panduit has introduced thousands of problem-solving new products, achieved over 780 U.S. patents and remains demonstrably committed to advancing state-of-the-art solutions," the release added
“Our new environment is sleek, attractive and high-tech - perfect for attracting new talent and fostering creative thinking,” commented Andy Stroede, senior vice president, R&D, at Panduit. He continued, "Panduit has also invested in constructing almost 20,000 sq. ft. of laboratory space; that includes a world-class thermal laboratory with a 640kW capacity on-site for R&D, partner-inclusive testing, and validation of real-world scenarios. This lab has been designed to push the limits of power and cooling infrastructure that we understand will be required in customers’ future data centers.”
See also:Panduit unveils HD Flex 2.0 system (July 12, 2016)
The labs in Panduit's new R&D complex include: a copper transmissions lab; an optics lab; an anechoic chamber; a data center thermal lab; and an industrial automation lab.
