The 2020 Cabling Innovators Awards includes six honorees in the category of cabling media. Proving that research, development, and innovation are alive and well in the realm of new-product development, these honorees are paving the way for future applications.
The MIC 250 2.0 cable from Corning is optimized for splicing and utilization with pigtail cassettes. The cable’s design uses subunits made up of 12x250-µm colored fibers. This design helps address challenges arising from the neverending need for increasing bandwidth, specifically including the growing popularity of pigtail splicing with cassettes. “Although tight-buffered cables can be fusion spliced to other tight-buffered cables as well as loose-tube cables, splicing tight-buffered fiber to loose-tube fiber is inefficient,” Corning explains. “Fusion splicing tight-buffered cables into cassettes using 250-µm fibers requires arduous processes.” Historically, an indoor loose-tube fiber cable optimized for fusion splicing with cassettes has not been widely available. Corning gathered installer feedback on the use of splice cassette installation with tight-buffered cabling solutions, and used that feedback to drive the creation of MIC 250 2.0, a splice-optimized indoor plenum loose-tube cabling solution.
Modular Photonics’s OMPlex singlemode emulator family is based on a passive plug-and-play silica photonic chip that solves the modal dispersion problem and enables multimode fiber to perform like singlemode fiber. OMPlex delivers fast data rates over long distances, supporting 1-, 10-, 25-, 40-, and 100-Gbit/sec transmission over 2 kilometers of all multimode fiber types. Modular Photonics explains it developed its products “after extensive consultation and analysis of customer problems, constraints, and market pressures.” The OMPlex family offers the following characteristics: Minimum 100x improvement in maximum data speed over MMF; low insertion loss (<2.5dB back-to-back) to stay within transceiver power budget; low product cost (substantially less than recabling a fiber link); small footprint (compatible with SFP components); quick installation time; a passive solution that avoids cost of additional electronics; transparent to IT protocols (compatible with 1310- and 1550-nm bands as well as wavelength-division multiplexing formats); long-life operation and compliance to non-hazardous material requirements. “The OMPlex upgrade solution for a single duplex fiber link has a typical cost point of $2,000, comprising $1,500 for a pair of the OMPlex duplex devices, $400 for a pair of generic high-speed transceivers, and $100 labor,” explains Modular Photonics. “This cost point is independent of the link length or type of multimode fiber used.”