It has been five years since the TIA-569-E standard came out. Since then, there have been updates to the standard, and coming out soon will be the TIA-569-F standard.
Updates to the TIA-569-E standard
In June 2022, the TIA published “Addendum 1, Revised Temperature and Humidity Requirements” which updated TIA‑569‑E to integrate the referenced temperature and humidity requirements that were published in ASHRAE Thermal Guidelines for Data Processing Environments, Fifth Edition.
One of the major changes from the previous standard was the incorporation of TIA‑569‑D‑1’s temperature and humidity requirements. Per Cindy Monstream, Vice-Chair of the TIA’s Engineering Committee, this led to the “revision of the recommended upper relative humidity limit for classes A1 through A4, with the new limit being established using copper and silver corrosion strip testing.” She also noted that there was the “addition of a new class H1 for high density cooling.”
Another major change was the addition of pathway and space considerations for support remote powering over balanced twisted‑pair cabling from TIA‑569‑D‑2. Standard TIA-569 has some general information in Annex C on remote powering (as referenced in the tables below) but the primary guidance is in TSB-184.
Information on TIA-569-F
The significant changes from TIA-569-E to TIA-569-F include the incorporation of revised temperature and humidity requirements of TIA-569-E-1, the incorporation of Zone Enclosure section from TIA-862, and the conversion of generic terms to structured cabling terms utilized in premise standards.
Monstream says to “keep in mind that this will be the first time this goes out for comments so there might be much more or the committee could vote
