Three new products from Ventev Wireless—two antennas and a mount—have been introduced to meet WiFi deployment challenges in large venues with a high number of simultaneous users. Ventev is a division of Tessco Technologies, and the newly introduced products are part of the TerraWave portfolio of products and technologies. The new antennas and mount “support access points from most industry-leading manufacturers,” the company said.
When introducing the products, Ventev explained, “As WiFi-capable devices such as smartphones and tablets become more and more prevalent in universities, convention centers, airports, manufacturing facilities and other large venues, network owners must convert their traditional, coverage-oriented WiFi networks to high-density networks with sufficient capacity to support numerous individual client devices.”
Ventev’s 4 dBi High-Density Patch Antenna (pictured below, left) and its 6 dBi High-Density Patch Antenna with Narrower Beamwidth (pictured below, right) separately address RF-interference challenges. “Minimizing channel interference or ‘beam bounce’ is a critical component of a high-density network,” Ventev explained, “and until now, a frustrating challenge for network administrators trying to maximize capacity.” The company characterizes its 4 dBi High-Density Patch Antenna as follows: “The lower gain of the TerraWave 4dBi Antenna limits RF interference, making it an ideal solution for facilities with lower ceilings and multi-levels, like classrooms and lecture halls, where floor-to-floor interference exists and signal bounce must be minimized.” It also describes the features and benefits of the 6 dBi high-Density Patch Antenna with Narrower Beamwidth: “With a narrower 55-35 degree beamwidth, the new 6 dBi antenna complements the range of 6 dBi TerraWave antennas. Boasting the latest advanced technology in high-density antennas, it reduces the number of users per access point, increasing capacity and improving the individual WiFi user experience.”
